南京-江宁区 | 5-7年经验 | 本科 | 招1人 | 03-05发布 | 英语熟练
岗位描述:
1. Review客户的设计文件主要包括BOM,组装图,Gerber文件及电路图
2. 在SAP中发行BOM,同时管理ECN(工程变更)
3. 对客户端反馈的或者制成中发现的不良进行失效分析
4. 为新产品设计低成本,符合人体工学,高效安全的包装方式
5. 作为面对客户的一个技术窗口
6. 协调新产品验证
7. 负责元器件本地化
要求:
1. 本科及以上学历,机械或电子等相关专业
2. 三年以上电子成品设计或制造经验
3. 熟悉Auto CAD,Gerber tool, UG者优先
4. 熟练的英语听说读写能力
Job Description
Review design packaging from customer, mainly include BOM ,assembly drawing, Gerber file and Schematic
Prepare BOM in SAP and manage ECN(Engineering change notice)
Perform failure analysis regarding customer claims and production failures if and when found necessary
Develop cost-effective, ergonomic, efficient and safe packing solution for the new products.
To be the technical window person with customer
To be the coordinator for NPI product validation
To be in charge of components localization
Requirement
Bachelor degree or above, major in Electronics, mechanical or relative
3+ years design or manufacture experience in electronic products
Be familiar with Auto CAD , Gerber tool. UG is preferred.
Fluent English in Listening, Speaking, Reading and Writing
Job Description
Requirement
职能类别:产品工艺/制程工程师半导体工艺工程师
上班地址:南京江宁开发区吉印大道3098号
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