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Staff.Package Design Engineer

苏州 15-20万/年

楼氏电子(苏州)有限公司

该公司所有职位

外资(欧美)   |  1000-5000人   |  电子技术/半导体/集成电路

5-7年经验 本科 招2人 04-19发布
英语熟练

五险一金 补充医疗保险 免费班车 员工旅游 交通补贴 餐饮补贴 专业培训 出国机会 年终奖金 定期体检

职位信息

Duties and Responsibilities:
1) Design microelectronics packaging, components and assemblies for MEMS surface mount microphones.
2) Work directly with key customers to develop design concepts, review options, and resolve technical issues.
3) Act as packaging design engineer over the entire life cycle of new product development from prototype design to full mass production launch.
4) Produce fabrication prints and manufacturing documentation for new products.
5) Handle requisitions, quotes and placement of purchase orders for R&D prototypes
6) Coordinate cross functional design reviews.
7) Work with manufacturing engineers and suppliers for design development and fabrication.
8) Work with process engineers in developing platform design rules.
9) Work with quality engineers in to ensure designs meet all quality and reliability requirements.
10) Acquire and apply new knowledge as required by dynamic product development environment.
11) Search for and evaluate new suppliers and the viability of new packaging technologies.

Job Specifications
1) BS degree in Mechanical or Materials Science Engineering, advanced degree a plus.
2) Minimum 2 years of related experience in microelectronics packaging design, development and fabrication.
3) Experience working as a direct technical interface to customers to develop design concepts and resolve issues.
4) Strong background in design for assembly and design for low cost manufacturing.
5) Familiarity with applicable electronics packaging industry standards such as IPC and JEDEC.
6) Strong understanding of mechanical engineering design principals and the ability to apply them to innovate and solve complex problems.
7) Experience in SolidWorks and/or AutoCAD or equivalent. Experience with PADS layout tool will be considered as a plus
8) Experience with PCB/IC substrate materials and fabrication processes.
9) Basic knowledge of semiconductor materials and fabrication processes.
10) Experience with package design for RF components, both passive and active.
11) Knowledge of geometric dimensioning and tolerancing, tolerance stack-up principles and understanding of real-world fabrication processes.
12) Knowledge of acoustics is a plus.
13) Ability to multi-task within a fast paced , dynamic environment
14) Team player, detail-oriented, self-motivated and able to work independently with minimal guidance
15) Software skills including MSOffice, Excel and statistical analysis are required.
16) Excellent verbal and written communication skills
17) Ability to travel internationally 2-3 times per year as required.

职能类别: 技术研发工程师

联系方式

上班地址:苏州相城经济开发区春兴路20号

地图

公司信息

楼氏电子(苏州)有限公司是在苏州工业园区投资建厂最早的美国独资企业之一,总部位于芝加哥,自1996年开业以来生产经营得到了飞速的发展,现已有同仁约2500名,楼氏苏州已成为楼氏全球最大的生产基地和战略发展中心,独特而专业的声学技术使我们的超微型声电转换器及语音识别产品广泛应用于助听器、手机和手提电脑等各类产品,并且多年来保持着世界一流领先地位。公司因扩产从海外引进新项目,需增聘一批有才华,有能力,有责任心,有团队精神的高素质人才加盟楼氏,公司将为优秀的人才提供优厚的薪资待遇和海外培训机会。

请将简历发至keshr@knowles.com(注:请用英文标题,不要使用RAR文件)

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