1.Set up process specifications, qualify newly installed tools & new product
2.Analyze process deviations and equipment failures, execute solutions&implement control plans to improve operation efficiency & maximize yield
3.Perform process window checks & setup process control limits
4.Work with Process Integrationcustomers to improve process capabilities and reliability
5.Work closely with manufacturing team on cost reduction and cycle time improvement
1.Degree in Material ScienceChemicalElectronicsElectrical Engineering with 1--3 years of experience in semi-conductor or wafer processing
2.Experience in Wafer Bumping, Thin Films (PVDPECVD), Photolithography,Wet Etching, Clean Technology, metrology tools & ECP (plating) processes would be a distinct advantage
3.Familiar with SPC & ability to perform DOEFMEA to improve process margins will be advantageous.