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资深工艺工程师 四川科尔威光电科技有限公司 成都-双流区 1-1.5万/月 10-24

学历要求:本科|工作经验:10年以上|公司性质:民营公司|公司规模:50-150人

1.协助技术研发部经理制定量产产品维护工作计划,为相关重大决策提供建议和信息支持;2.制定产品维护工作流程,规章规范,实施细则并监督执行;3.组织开展与新产品开发人员的产品转产衔接工作;4.根据公司产品维护计划制定产品良率提升目标、质检部纠偏问题解决目标并下达任务;5.组织工艺优化和工艺流程优化,与制造部协调生产操作规范的更改和完善;6.根据新产品需求,组织新工艺开发,为新产品开发提供技术支持并没满足新产品需求;7.组织与品质部门协调质检标准的更改和完善;8.定期组织例会,指导、监督、检查所属下级各项工作,对关键工作节点进行把控;9.协调下属人员与其他岗位人员之间的配合工作;10.定期向上级汇报工作并承接上级指派的新工作任务。任职要求:1. 教育水平:大学本科或以上;2. 专业:物理学、光电子、电子信息技术相关专业;3. 经验:10年以上工作经验,5年以上工艺整合经验;4. 知识与技能:通晓半导体工艺相关方面的专业知识,具备团队管理等方面的知识;5. 个人素质:具有较强的领导能力、组织能力、沟通能力、影响力、计划与执行能力。

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工艺专家(退休返聘) 武汉氢阳能源有限公司 武汉-东西湖区 1-1.5万/月 10-23

学历要求:本科|工作经验:10年以上|公司性质:外资(欧美)|公司规模:50-150人

岗位职责:1、负责工艺专业的技术发展,制定本专业技术,开发工艺技术包;2、负责相关技术领域及工艺产品的技术工作,制定发展规划并组织实施、过程控制及落实考核;3、指导工艺专业人员进行工艺流程的设计与计算;4、培养公司工艺方面的技术人才;5、负责指导项目质量工艺控制部分工作,含工艺方面文件审查、工艺内审会议、工艺资质的评选、工艺项目的指导等。任职资格:1、本科以上学历,化学工程、化学工程与工艺等相关专业;2、20年及以上工艺设计相关工作经验;具有过设计院、大型化工厂工艺方面经验;3、具有技术开发和计划执行能力;具有高级职称;4、较强的沟通、协调、组织、规划能力。具体薪资:面议。

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Principal Process Engineer 深圳前海普卓生活科技有限公司 深圳 2-2.5万/月 10-23

学历要求:本科|工作经验:10年以上|公司性质:民营公司|公司规模:少于50人

The Company The company is headquartered in North America, with factories and branch offices in several countries. It is one of the world’s leading high-tech companies in the development, manufacture and supply of light solutions, their products focused in semiconductor laser, photonics integration, and subsystem design, etc. The Job ? Lead an experienced technical team for process design and engineering development. ? Define and develop process capabilities. ? In charge of DFM analysis or review. ? Manage technical and engineering development programs. ? Generate technical proposals and technical reports. The Incumbent ? Bachelor degree or above in mechanical/materials engineering/automation or relevant Engineering field. ? 10+ years’ working experience in the fiber-optics industry or related industry, experience in managing technical program or development team would be preferred. ? Be self-motivated and able to bring the best from team members. ? Proficient in both English and Chinese.

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Principle EOL Process engineer 快捷半导体(苏州)有限公司 苏州-工业园区 1.5-2万/月 10-23

学历要求:本科|工作经验:10年以上|公司性质:外资(欧美)|公司规模:1000-5000人

Qualifications Bachelors or Masters Degree in Engineering and Science. Good Oral and written EnglishMore than 10 years in EOL Molding process, 5 years plus in team management Duties and Responsibilities Be the engineering leader of EOL area. Lead and manage engineer team to achieve factory KPI and company goal. Be expert at certain process steps, mainly for Molding, Plating, Trim and Form process. Focus on the yield, SCOP and Six Sigma and lean production improvement projects. Use FMEA/FTA/DOE. Etc. as the continuous improvement tools, continually improve the process capability (Such as process Cpk) and productivity by process characterization. Optimize process window and working method, provide the training and signoff for the operation staff. Support the success of new product introduction, capacity expansion and engineering evaluation, follow up with APQP requirements. Improve process quality towards zero defects, address the customer complaint by 8D methodology with team work, and update the learning into FMEA/CP to prevent recurrence. Timely close line abnormal such as maverick lots, QCN, OCAP, SPCN with quick containment actions and root cause identification, to meet plant wide cycle time goal. Lead or support cost reduction initiatives and work for material 2nd sources and localization. Provide good internal customer services to all sections in order to achieve the overall company mission, such as machine or process qualification and buyoff etc. Plating Subcon management for technical support and support plating process improvement. Keep up with new Technology and advanced materials for consideration to improve the process with innovation. Cultivate talents for each process. Other responsibility to be assigned based on the business need.

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结构工程师 安徽天瑞电子科技有限公司 芜湖 4.5-6千/月 10-23

学历要求:中技|工作经验:10年以上|公司性质:民营公司|公司规模:500-1000人

1.按照产品开发需求,设计产品外观及内部结构;2.根据产品开发需求,制作产品开发计划,及时跟进模具开发进度,保证产品按时完成开发;3.模具制造好后,根据模具厂家提供的试模样品,解决试模后的产品结构问题及提供改模资料;4.新款产品结构样品确认、小批量试产跟进并导入量产;5.按照工艺要求对产品的相关结构特性进行验证确认;6.对外协制造的模具建立验收标准,并依据标准判定,对不符合项建立整改报告;7.建立模具的档案管理;8.完成相关结构件平面图纸的绘制;任职条件:1.精通一种三维绘图软件(Proe为佳)及CAD软件;2.熟悉了解注塑模具;3.熟悉ABS、PC、PA等工程塑料性能及特性;4.了解生产装配工艺,要有两年以上电子产品、小家电等产品开发经验; 请关注工作地点!!

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高级制造工艺工程师PCBA & Soldering(经理级) 苏州瑞索斯管理咨询有限公司 苏州 35-50万/年 10-23

学历要求:本科|工作经验:10年以上|公司性质:外资(欧美)|公司规模:少于50人

Job Title: Senior Manufacturing Process Engineer, PCBA & SolderingReports to: Engineering Manager or Technical LeadGeneral SummaryThe Senior Manufacturing PCBA & Soldering Process Engineer is responsible for leading and assisting with various technical activities to ensure the manufacturability of PCBA (Printed Circuit Board Assembly) product designs, solder process development, and CM (Contract Manufacturer) process support to achieve acceptable quality, cost reduction, and maximization of production output. In this role involves close collaboration with Supplier Quality Engineers, Procurement, Component Engineers, Operations and Global Engineering teams to plan, develop, organize, manage, and coordinate specific objectives within four primary categories: 1) Design for Manufacture (DFM)2) New Product Introduction (NPI)3) Mass Production Support 4) New Technology Process Development1) Design for Manufacture (DFM)A. DFM AnalysisPerform DFM (Design for Manufacture) analyses through all phases of product development, providing guidance to design engineers to ensure acceptable manufacturability that meets IPC and CommScope standards. Apply assembly process expertise to define an optimal manufacturing process flow for each new product, ensuring compatibility with CM capabilities.B. DFM StandardsMaintain CommScope PCBA DFM Standards and ensure design teams properly understand and properly apply in their product designs.C. CommScope Common LibrarySupport global librarians in the development and maintenance of component footprint designs for the CommScope Common Library. Maintain CommScope decal design standards. Support Component Engineers with designer component selections to ensure compatibility with PCBA manufacturing processes. 2) New Product Introduction (NPI)A. Prototype Build SupportSupport CM in NPI prototype builds and product transfers, including process capability assessments, process flow definition, assembly and material requirements, fixture design/review, and build participation.B. Postbuild AnalysesReview CM’s postbuild analyses to identify product design improvements and manufacturing process issues; ensure that critical improvements are implemented prior to mass production. C. Transition to Mass ProductionReview CM’s plans to transition from NPI to mass production, including capacity analyses, line qualification, new assembly process implementation, operator training, etc.D. Technical Capability AssessmentsConduct technical capability assessments of potential (or current) CM’s.3) Mass Production SupportUtilize PCBA process expertise to collaborate with Supplier Quality Engineers to support the CM’s mass production activities, including:A. Product QualityEnsure that the CM’s production processes consistently produce products that meet IPC and CommScope end-point requirements. Provide process support for timely resolution of manufacturing issues related to product reliability, assembly workmanship and test yields, component vendor quality, and customer field failures. Help ensure quick, innovative, and accurate problem-solving to maintain production and revenue stream. B. Process Qualification Validate and ensure that standard, special, and new manufacturing processes or procedures are properly qualified to assure successful use on CommScope products.C. End-Point RequirementsDefine and document unique or special PCBA end-point requirements that the CM will utilize in their assembly process definition and inspection standards.D. Cost ReductionParticipate in product cost reduction efforts for improved manufacturing efficiency, lower costs, and labor reduction.4) New Technology Process DevelopmentInvestigate and develop new or advanced manufacturing technologies, including soldering processes, automation, solder alloy choices, inspection processes, repair/rework technologies, etc. Coordinate with CM for implementation and use on CommScope products.Education and Technical RequirementsMinimum 4-year degree in related technical curriculum and 7+ years of PCBA manufacturing experience; advanced degree desirable. Strong verbal & written communications skills, proficient with English, and able to function effectively in a team environment are required.

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摄类基板工艺专家\资工 深南电路股份有限公司 无锡 20-30万/年 10-23

学历要求:本科|工作经验:10年以上|公司性质:国企|公司规模:5000-10000人

A、 负责摄像头工厂工艺路线图规划和制定,设备评估和导入;B、负责提升摄像头专业工厂制程能力,满足新产品、新工艺导入要求,提升工厂产品竞争力;C、负责提升摄像头专业工厂制程稳定性,保证工厂产品顺利量产,满足客户对产品品质要求以及工厂良率目标;D、负责技术部工作流程建立与优化,保证技术部顺利履行部门职责,和各部门开展良好的团队合作;E、负责技术部团队管理工作,通过人员培养和激励提升团队专业水准和向心力,使团队离职率低于设定目标要求1. 本科,10年及以上刚挠板工艺或研发工作经验,其中从事手机摄像头模组刚挠板5年以上技术工作经验;2. 5年及以上项目管理经验,熟练掌握团队管理方法和技巧,有优秀的组织协调能力;3.熟练掌握刚挠产品研发设计、工艺能力提升、工艺稳定性提升的专业方法;4.熟悉APQP、FMEA、CP、SPC、MSA、PPAP等质量工具的应用5.掌握PCB从gerber 导入到出货的全流程沟通的操作模式和沟通方法。6.熟悉IPD管理流程;

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资深工艺设计工程师 江苏海普功能材料有限公司 苏州 1-3万/月 10-23

学历要求:本科|工作经验:10年以上|公司性质:民营公司|公司规模:50-150人

职位要求:(本职位可***,欢迎设计院或者退休人员投递简历)1、本科及以上学历;2、化学化工、环境工程相关专业,10年以上化工或环保工艺设计经验;3、能够根据研发提供的小试数据,进行设备选型,非标设备设计;4、能够独立完成废水项目的方案编制、工艺包设计,指导现场设备安装与验收,配合现场调试;5、责任心强,有担当,积极上进,勤奋踏实;有较强的人际沟通和组织协调能力;6、学习和创新能力强,有扎实的专业基础,善于学习新知识,了解本行业技术动态。岗位职责:1、根据研发人员的实验报告和相关参数,独立完成相关废水工艺设计,设备(包括材质)选型,非标设备设计,工艺包设计等;2、指导现场设备安装与验收,配合研发人员完成现场调试;3、协助市场人员拜访客户,负责技术方面沟通和信息反馈;4、其他领导交代的工作。

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高级工艺工程师(双休、福利好) 赛尔富电子有限公司 宁波 0.7-1.5万/月 10-23

学历要求:大专|工作经验:10年以上|公司性质:民营公司|公司规模:500-1000人

岗位职责:1、负责产品SMT、焊接或装配、测试工艺的制程异常分析、改进;2、负责新产品工艺的确认,工艺文件的编制,异常问题的分析、改进;3、负责新工艺、新设备的开发与引进;4、负责工装、夹具等工具的评估、引进、工艺规范制定、技术指导;5、负责工艺知识的培训与指导。任职要求:1、大专及以上,电子、机械相关专业,有10年以上电子厂工艺岗位经验;2、有丰富的工艺异常处理、工艺改善经验,具备工艺评审经验;3、熟悉SMT、波峰焊、老化、灌胶或者装配等生产工艺;

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高级工艺工程师 南京六九零二科技有限公司 南京 1-1.5万/月 10-22

学历要求:大专|工作经验:10年以上|公司性质:国企|公司规模:150-500人

工作职责:1.负责产品的工艺设计,确定产品的工艺路线,把控设计质量,确保产品的可制造性;2.对加工的的各工序进行工艺流程、加工方法、工装夹具的工艺设计;3.处理生产中的各类工艺问题,做好工艺技术问题攻关;4.负责公司的工艺技术、工作规划工作,并组织实施;5.对典型工艺进行试验和验证,编制典型工艺及专业工艺规程及相关规范;6.进行新工艺、新技术、新材料的试验、落实与应用。任职要求:1.大专及其以上学历,电子通信类或材料类相关专业;2.从事通信类电子产品行业的工艺工作十年以上;3.熟悉焊接、电子装联、材料、金属加工、镀覆、化工类等专业知识;3.能够熟练使用Office、AutoCAD等软件;5.熟悉产品生产流程,动手能力强,有分析解决工艺问题的能力;6.具有较强的人际交往和沟通能力,具有团队协作精神及较强的责任心。

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