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Manufacturing Quality Engineering, Supplier Quali 超威半导体(中国)有限公司 深圳-福田区 2-2.2万/月 10-24

学历要求:本科|工作经验:8-9年|公司性质:外资(欧美)|公司规模:500-1000人

Manufacturing Quality Engineering – Supplier Quality Engineer Job Responsibilities: Join AMD’s team of highly skilled professionals in managing the quality performance of key manufacturing partners and suppliers in the production of our leading-edge Game Console, Graphics, Server and CPU products. Our presence in region gives this supplier quality team exposure to multiple AMD product development teams and manufacturing operation teams, in addition to our critical manufacturing partners and suppliers. This team partners with AMD Manufacturing Team and Procurement Team to drive our Suppliers proactively work towards AMD quality expectations and requirements. As a member of our Manufacturing Quality Engineering team, you will be a critical part of realizing AMD virtual integrated manufacturing with responsibilities that include: Job Description · Be direct quality interface with suppliers of assembly and testing service to AMD. · Implement quality metrics to drive end-to-end continuous improvement. · Ensure that assembly and test suppliers have developed and executed manufacturing quality/test control plan to insure compliance of product established specifications. · Drive systematic supplier performance improvement plans for reducing quality defects. · Drive SPC compliance and improvement projects to reduce out of control conditions. · Conduct audits at suppliers’ sites and participate in supplier evaluations. · Train and develop supplier to comply to AMD’s quality methodologies – 8D methodology/why-why analysis, responding to non-conformances, corrective action system, change management system. · Manage customer and internal quality issues and escalation, driving supplier root cause and corrective and preventive actions using 8D approach/why-why analysis. Skills/Experience · Minimum 7 years of experience in Semiconductor Manufacturing/Engineering/Quality Engineering with minimum of 3 years in supplier quality of bump, assembly and testing product experience are strongly preferred. · Experience in setting up and managing Supplier Quality and Supplier Management processes. · Supplier Auditor/Internal Auditor certification preferred. ISO9001, IATF16949, VDA6.3 etc. · Strong communication, teamwork and problem-solving skills. · Capable to work independently and work with other groups to provide solution · Knowledge of statistical analysis. · Fluent in both spoken and written English. Education Requirement · Required Degree: BS · Preferred Degree: MS · Preferred Major: Electrical Engineering

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LED外延开发高级工程师 芜湖德豪润达光电科技有限公司 芜湖 20-30万/年 10-24

学历要求:博士|工作经验:无工作|公司性质:上市公司|公司规模:500-1000人

岗位职责:1、负责MOCVD机台量产工作,调整菜单参数,保证产品良率及稳定性;2、设计外延结构,克服光效衰减,提升亮度;3、前沿专案开发,研究LED外延领域新兴的工艺技术;4、研发专利编撰。任职要求:1、博士学历,本硕博均为一流院校,特别优秀者可放宽至本硕一本;2、半导体、材料物理、光电相关专业,对氮化镓有较深入的研究;3、热爱LED外延行业,对工作充满激情,富有创造力,同时能够仔细、认真、严谨,具备开发人员的基本素养。职位亮点:1、高薪,保证衣食无忧,甚至还有一点潇洒;2、宽松自由的工作氛围,给您足够的自主思考、研发空间;3、大咖云集,周边同事均为高智商人群,学霸满天飞,沟通无间隙;4、良好的职业生涯晋升通道,公司高层均为技术出身,身为技术大牛的你必定获得更多青睐。

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Field Process Engineer -Dep 泛林半导体设备技术(上海)有限公司 厦门 20-35万/年 10-23

学历要求:硕士|工作经验:3-4年|公司性质:外资(欧美)|公司规模:150-500人

Field Process Engineer -DepResponsibilities:-Responsible for completion of process support and installation of new wafer etching and cleaning systems at customer sites. This will include evaluation and documentation of process outputs of hardware modifications/upgrades to existing systems.-Setup and complete experiments, collect data and generate reports for both internal and external distribution.-Develop process for new application at customer sites on existing Lam equipment.-Define problems and objectives, develop approach, analyze results and provide recommendation for new and previously installed Lam equipment.Requirements:- Fresh PhD graduate, Master >2 years’ experience in semiconductor industry.- Majoring in Micro-electronics/Chemistry/ Physics/ material science related.- Fluency in writing and oral English.- Effective communication and interpersonal skills.

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BMS行业拓展高级经理 美的集团中央空调事业部 佛山 2-4万/月 10-23

学历要求:|工作经验:10年以上|公司性质:民营公司|公司规模:10000人以上

岗位职责:1、负责BMS产品行业拓展,开拓市场销售渠道;2、负责制定BMS产品策略、市场策略及行业推广方案;3、协助重点工程项目售前、售中技术支持;任职要求:1、国际知名楼宇控制企业10年以上工作经验,熟悉西门子、江森、霍尼威尔等主流产品现状及行业发展趋势,有丰富BMS产品市场推广、产品销售工作经验;2、具备独立的BMS新产品市场拓展能力,及建立市场销售渠道的能力;3、具有较强的产品策划能力,产品包装、推广能力;4、具有较强的抗压、创新能力,具有较强的执行力,分析与解决问题的能力,具有良好的团队协作意识,有良好的沟通、谈判能力;5、硕士研究生以上学历。

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Principal Process Engineer 深圳前海普卓生活科技有限公司 深圳 2-2.5万/月 10-23

学历要求:本科|工作经验:10年以上|公司性质:民营公司|公司规模:少于50人

The Company The company is headquartered in North America, with factories and branch offices in several countries. It is one of the world’s leading high-tech companies in the development, manufacture and supply of light solutions, their products focused in semiconductor laser, photonics integration, and subsystem design, etc. The Job ? Lead an experienced technical team for process design and engineering development. ? Define and develop process capabilities. ? In charge of DFM analysis or review. ? Manage technical and engineering development programs. ? Generate technical proposals and technical reports. The Incumbent ? Bachelor degree or above in mechanical/materials engineering/automation or relevant Engineering field. ? 10+ years’ working experience in the fiber-optics industry or related industry, experience in managing technical program or development team would be preferred. ? Be self-motivated and able to bring the best from team members. ? Proficient in both English and Chinese.

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工艺工程师 赛诺微医疗科技(浙江)有限公司北京分公司 北京-朝阳区 20-35万/年 10-23

学历要求:本科|工作经验:3-4年|公司性质:民营公司|公司规模:50-150人

岗位职责:1.负责研发的设计工艺评审和提供设计工艺意见;2.负责监督和推进加工和模具的制造和验证;3.负责产品的生产夹具工装的设计和制作;4.负责产品检验和检验的工具设计和制作;5.负责项目的设计转移工作。任职要求:1.熟悉研发的设计工艺评审和提供设计工艺意见;2.熟悉各种加工工艺和模具的制造和验证;3.独立完成过三个产品以上的生产夹具工装的设计和制作;4.了解产品检验和检验的工具设计和制作;5.完成2个及以上项目的设计转移生产的工作,了解详细流程;6.有医疗行业经验优先。

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器件工程经理/总监 矽力杰半导体技术(杭州)有限公司 杭州 20-50万/年 10-23

学历要求:本科|工作经验:10年以上|公司性质:外资(欧美)|公司规模:150-500人

工作描述(Job Description):主持半导体功率器件和集成电路技术和产品的研发。根据公司技术路线图和系统解决方案的要求定义技术和产品规格, 带领器件研发团队从事相关工艺器件技术和产品的研发包括: 设计技术方案,工程流片和测试 ,可靠性和质量验证,量产良率的提升。Lead the development of power semiconductor device and IC technology. Define the technology and product specification according to the technology roadmap and system solution need, and drive different phases of RD development: from specification to solution, from simulation to experiment, from characterization to qualification, from engineering to production release.工作要求 (Qualification):十年以上的研发经验 (POWER MOSFET, BCD PROCESS 等),需要有相关的工程管理和团队建设经验。At least 10 years of relevant experience on power device and IC technology development such as power MOSFET design or BCD process development. Management position requires relevant experience on engineering management and team building.

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高级制造工艺工程师PCBA & Soldering(经理级) 苏州瑞索斯管理咨询有限公司 苏州 35-50万/年 10-23

学历要求:本科|工作经验:10年以上|公司性质:外资(欧美)|公司规模:少于50人

Job Title: Senior Manufacturing Process Engineer, PCBA & SolderingReports to: Engineering Manager or Technical LeadGeneral SummaryThe Senior Manufacturing PCBA & Soldering Process Engineer is responsible for leading and assisting with various technical activities to ensure the manufacturability of PCBA (Printed Circuit Board Assembly) product designs, solder process development, and CM (Contract Manufacturer) process support to achieve acceptable quality, cost reduction, and maximization of production output. In this role involves close collaboration with Supplier Quality Engineers, Procurement, Component Engineers, Operations and Global Engineering teams to plan, develop, organize, manage, and coordinate specific objectives within four primary categories: 1) Design for Manufacture (DFM)2) New Product Introduction (NPI)3) Mass Production Support 4) New Technology Process Development1) Design for Manufacture (DFM)A. DFM AnalysisPerform DFM (Design for Manufacture) analyses through all phases of product development, providing guidance to design engineers to ensure acceptable manufacturability that meets IPC and CommScope standards. Apply assembly process expertise to define an optimal manufacturing process flow for each new product, ensuring compatibility with CM capabilities.B. DFM StandardsMaintain CommScope PCBA DFM Standards and ensure design teams properly understand and properly apply in their product designs.C. CommScope Common LibrarySupport global librarians in the development and maintenance of component footprint designs for the CommScope Common Library. Maintain CommScope decal design standards. Support Component Engineers with designer component selections to ensure compatibility with PCBA manufacturing processes. 2) New Product Introduction (NPI)A. Prototype Build SupportSupport CM in NPI prototype builds and product transfers, including process capability assessments, process flow definition, assembly and material requirements, fixture design/review, and build participation.B. Postbuild AnalysesReview CM’s postbuild analyses to identify product design improvements and manufacturing process issues; ensure that critical improvements are implemented prior to mass production. C. Transition to Mass ProductionReview CM’s plans to transition from NPI to mass production, including capacity analyses, line qualification, new assembly process implementation, operator training, etc.D. Technical Capability AssessmentsConduct technical capability assessments of potential (or current) CM’s.3) Mass Production SupportUtilize PCBA process expertise to collaborate with Supplier Quality Engineers to support the CM’s mass production activities, including:A. Product QualityEnsure that the CM’s production processes consistently produce products that meet IPC and CommScope end-point requirements. Provide process support for timely resolution of manufacturing issues related to product reliability, assembly workmanship and test yields, component vendor quality, and customer field failures. Help ensure quick, innovative, and accurate problem-solving to maintain production and revenue stream. B. Process Qualification Validate and ensure that standard, special, and new manufacturing processes or procedures are properly qualified to assure successful use on CommScope products.C. End-Point RequirementsDefine and document unique or special PCBA end-point requirements that the CM will utilize in their assembly process definition and inspection standards.D. Cost ReductionParticipate in product cost reduction efforts for improved manufacturing efficiency, lower costs, and labor reduction.4) New Technology Process DevelopmentInvestigate and develop new or advanced manufacturing technologies, including soldering processes, automation, solder alloy choices, inspection processes, repair/rework technologies, etc. Coordinate with CM for implementation and use on CommScope products.Education and Technical RequirementsMinimum 4-year degree in related technical curriculum and 7+ years of PCBA manufacturing experience; advanced degree desirable. Strong verbal & written communications skills, proficient with English, and able to function effectively in a team environment are required.

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基础库设计工程师 福州瑞芯微电子股份有限公司 上海-浦东新区 2-4万/月 10-23

学历要求:硕士|工作经验:|公司性质:民营公司|公司规模:500-1000人

岗位职责:1.在28nm或22nm工艺节点,在原有Foundry 提供的标准单元库,Memory, IO等库的基础上,Characterize基于不同电压、温度的库,以满足当前产品应用对IC的需求; 2. 定制一些标准单元,作为对Foundry提供的基础单元库的补充,例如部分是针对高性能的,部分是针对低功耗的; 3.能完成针对不同工艺的全套STD、Memory、IO的设计;岗位要求:1. 硕士及以上学历2. 5年以上28nm及以下工艺节点 STD cell/ Memory等基础单元的设计经验。 3. 良好的沟通能力,能按SoC芯片的要求,定制相关的模拟IP。

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机械加工和工艺工程师 尔智自动化科技(上海)有限公司 上海-闵行区 2.5-3万/月 10-23

学历要求:硕士|工作经验:8-9年|公司性质:民营公司|公司规模:50-150人

1、负责公司机械产品可生产性把控;2、负责整个生产流程,生产工艺,生产验收的管理  。任职资格:1、硕士以上学历,机电一体化专业背景;2、10年以上机电一体化产品生产经验;3、精通各类加工工艺,尤其机械加工,压铸的设计要求;4、精通机械装配流程和工艺评估方法,控制产品一致性;5、有过至少10款工业级机电一体化设备量产经验;  

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